Blind & Buried vias PCB
Product attributes
Layer count：12 layer
Aspect ratio：12
Min hole size：0.15mm
Line width/space：4/4mil
Blind vias：1-2/1-3/1-4/1-5
Product features
High density build up
Various surface finishes
Microvia filling and stacked vias
Thin board and surface flatness
Applications
Communications
Related products
Metal based (core) PCB
Metal material：Aluminium, copper
Copper foil thickness：≤6 OZ
Copper layers：Single-sided, double sided, multilayer metal core
Thermal conductivity：2-12w/m∙k
Thermo-electric separation PCB
Material：Thermal conductivity (0.3-2W/m∙k)
Thermal pad treatment：Flat, Sinking
Outer layer copper(base)：0.5-18oz
Copper base thickness：0.8-3.2mm
High frequency board
Material：Rogers,Taconic,Arlon,Panasonic,TUC,Wangling
Structure：Single material,hybrid pressing,metal based.
Surface finish：Copper,OSP,ENIG,Immersion Tin, HASL
Max layer count：16
Millimeter wave radar board
Material：PTFE+FR-4
Linear precision：±8μm
Special technology：Blind & buried vias, POFV.
Technology advantage：PTFE multi-layer, Hybrid pressing.
EA value：≤15um
