Stepped G/F board
Product attributes
Board thickness：rn≥2.0mm
G/F thickness：≤1.6mm±0.1mm
G/F tolerance：±0.05mm
Layer count：≤44 layers
Product features
High density laminated structure
Various surface treatment methods
Hole filling electroplating and hole stacking structure
Sheet and surface flatness requirements
Applications
Communications
Related products
Metal based (core) PCB
Metal material：Aluminium, copper
Copper foil thickness：≤6 OZ
Copper layers：Single-sided, double sided, multilayer metal core
Thermal conductivity：2-12w/m∙k
Thermo-electric separation PCB
Material：Thermal conductivity (0.3-2W/m∙k)
Thermal pad treatment：Flat, Sinking
Outer layer copper(base)：0.5-18oz
Copper base thickness：0.8-3.2mm
High frequency board
Material：Rogers,Taconic,Arlon,Panasonic,TUC,Wangling
Structure：Single material,hybrid pressing,metal based.
Surface finish：Copper,OSP,ENIG,Immersion Tin, HASL
Max layer count：16
Millimeter wave radar board
Material：PTFE+FR-4
Linear precision：±8μm
Special technology：Blind & buried vias, POFV.
Technology advantage：PTFE multi-layer, Hybrid pressing.
EA value：≤15um
