Backplane
Product attributes
Max board size：1100mm X 610mm
Max board thickness：6.5mm
Max aspect ratio：25:1
Product features
高密度积层结构
High density build up
多种表面处理方式
Various surface finishes
填孔电镀和叠孔结构
Microvia filling and stacked vias
薄板和表面平整度要求
Thin board and surface flatness
Applications
通信产品
Communications
Related products
Metal based (core) PCB
Metal material：Aluminium, copper
Copper foil thickness：≤6 OZ
Copper layers：Single-sided, double sided, multilayer metal core
Thermal conductivity：2-12w/m∙k
Thermo-electric separation PCB
Material：Thermal conductivity (0.3-2W/m∙k)
Thermal pad treatment：Flat, Sinking
Outer layer copper(base)：0.5-18oz
Copper base thickness：0.8-3.2mm
High frequency board
Material：Rogers,Taconic,Arlon,Panasonic,TUC,Wangling
Structure：Single material,hybrid pressing,metal based.
Surface finish：Copper,OSP,ENIG,Immersion Tin, HASL
Max layer count：16
Millimeter wave radar board
Material：PTFE+FR-4
Linear precision：±8μm
Special technology：Blind & buried vias, POFV.
Technology advantage：PTFE multi-layer, Hybrid pressing.
EA value：≤15um
