Metal material：Aluminium, copper

Copper foil thickness：≤6 OZ

Copper layers：Single-sided, double sided, multilayer metal core

Thermal conductivity：2-12w/m∙k

Material：Thermal conductivity (0.3-2W/m∙k)

Thermal pad treatment：Flat, Sinking

Outer layer copper(base)：0.5-18oz

Copper base thickness：0.8-3.2mm

Material：Rogers,Taconic,Arlon,Panasonic,TUC,Wangling

Structure：Single material,hybrid pressing,metal based.

Surface finish：Copper,OSP,ENIG,Immersion Tin, HASL

Max layer count：16

Material：PTFE+FR-4

Linear precision：±8μm

Special technology：Blind & buried vias, POFV.

Technology advantage：PTFE multi-layer, Hybrid pressing.

EA value：≤15um

Board thickness：rn≥2.0mm

G/F thickness：≤1.6mm±0.1mm

G/F tolerance：±0.05mm

Layer count：≤44 layers

Material：FR4, high frequency, high speed material

Finger size tolerance：±0.075mm

Special technology：HDI micorvia filling

Signal transmission rate：≤100 Gbps